The major physical difference between the SECC (left image) and SECC2 (right image) form factor is the presence of a thermal plate. The SECC2
processors are built without the thermal plate - as a result, the direct thermal interface with the processor core allows for better cooling. Due to this physical difference, CPU installation with the
retention module differ among the Pentium II form factors.
On both sides of the SECC2 CPU
reside the lower tabs of the aluminum heat sink and the bottom corners of the plastic CPU enclosure (see left figure). The tabs and corners should fit into the retention braces.
Currently, the retention module recommended for
securing the SECC2 CPU is included in the motherboard package. The retention braces consist of two small components that resemble `book-endsī. (see left figure).