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TYAN Press Release

TYAN DEBUTS SMALL YET POWERFUL DUAL XEON DDR2 SERVER BOARD

Tyan Tiger i7322DP (S5353) has all the power of a Full-size server board, but in a smaller package
Products: S5353 


TAIPEI, TAIWAN, February 10th, 2006 - Many of today's server products encompass a wide range of features to meet a wide range of applications so that any number of requirements can be fulfilled by a single product. Following that trend, today Tyan is introducing a highly-compact and versatile dual Intel® Xeon® server board: the Tiger i7322DP (S5353), a densely-packed server board with all of the features of full-size server boards, in a smaller package.

The Tiger i7322DP (S5353) uses the Intel E7320 chipset with an optimized 1U layout design on all components to allow for improved airflow over all parts of the motherboard. Several exciting features are included in the design of the Tiger i7322DP, such as:
 
  • 1U-optimized layout for best airflow and thermal management in rackmount environment
  • Support for Intel Xeon processors with EM64T (64-bit), XD, and Dual Core technology
  • Supports up to 12GB of DDR2-400 Registered memory with ECC checking
  • Two (2) Gigabit network ports and one (1) 10/100 network port
  • One (1) PCI-X slot and one (1) PCI-32 slot
  • TARO™ add-on SO-DIMM socket for SATA-II and SAS functionality
  • Integrated Serial ATA with RAID levels supported (0, 1)
  • Built-in 16MB XGI Volari™ Z7 video controller with external video port
  • Remote management features including IPMI 2.0, all in an SSI CEB form factor


"The continued shrinking of server technologies into ever smaller packages has provided the IT industry with a range of solutions which can meet a full breadth of customer requirements, ," said Danny Hsu, VP of Sales and Marketing at Tyan Computer Corporation. "Through the debut of the Tiger i7322DP (S5353), Tyan has effectively delivered a server platform solution that leverages highly-integrated technology and the power of Intel microarchitecture to provide full-performance server computing power in a small, highly-flexible form factor."

The Tiger i7322DP (S5353) is currently sampling, and will reach mass production levels shortly through mid-Q1'06.