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TYAN Press Release

TYAN LAUNCHES CACHING APPLIANCE AND DISPLAYS FULL ARRAY OF PLATFORMS AT COMPUTEX 2014

TYAN launches and live demos its first ever Cache Appliance Solution based on Intel® Solid State Drive DC P3700 and Intel® Cache Acceleration Software Targeting Embedded, Cloud Computing, HPC, Datacenter, and SMB, TYAN showcases a rich product portfolio supporting Intel® Xeon® E3-1200 v3, 4th Generation Intel® Core™ processor i3, Intel® Xeon® processor E5-2600 v2, and the Intel® Xeon Phi™ Coprocessor.


Taipei, Taiwan - June 3rd, 2014 –TYAN, an industry-leading, server platform design manufacturer and subsidiary of MiTAC International Corp, today announced the launch of its first ever Cache Appliance Solution based on Intel® Xeon® E5-2600 v2 processor, Intel® SSD DC P3700 and Intel® Cache Acceleration Software. Along with this product, Tyan is demonstrating its full array of server platforms supporting the Intel® Xeon® E3-1200 v3 (formerly codenamed "Haswell DT"), 4th Generation Intel® Core™ processor i3, Intel® Xeon® processor E5-2600 v2 and the Intel® Xeon Phi™ Coprocessor at TYAN Private Demo Room (#449) on 4th floor of TWTC Nangang Exhibition Hall during Computex 2014 (June 3-7) in Taipei.

"TYAN's philosophy is to help customers accelerate its business by deploying a flexible, simple, efficient, and intelligent IT infrastructure by offering a full array of platforms," said Albert Mu, Vice President of MiTAC International Corporation's TYAN Business Unit. "TYAN is adopting Intel's latest technology to develop a rich portfolio from entry-level to high-performance computing; and those cutting-edged platforms will be showcased at Computex 2014. More than that, TYAN'sCache Appliance Solutions will offer unparalleled choice for customers in building powerful storage applications with higher performance and lower cost."

"Intel's DC P3700 SSDs and Intel® Cache Acceleration Software, offer a powerful combination delivering I/O per second performance that provides customers with industry leading capabilities" said Jake Smith, Director, NVM Solutions Group, Intel. "The high performance SSD enables faster transition to SSD based solutions for a variety of applications from cloud computing to software defined infrastructures for today's generation of datacenter deployments."

New TYAN Cache Appliance Solution: The first ever Cache Appliance product, TYAN GT24-B7067 deployed with Intel® Xeon® processor E5-2695 v2 and Intel® SSD DC P3700 Series 400GB AIC and Intel® Cache Acceleration Software V2.5 will be live demoed.

TYAN launches its first ever Cache Appliance Solution and will have product live demoed during the Computex 2014. TYAN aimed in developing a simple, scalable, easily deployed, and cost-effective Cache Appliance Solutions to help customers drive their business. TYAN GT24-B7067, the first product in this Cache Appliance category, is being live demoed with (2) Intel Xeon® Processor E5-2695 v2, (8) DDR-III 1600 16GB memories, (1) Intel® SSD DC P3700 Series 400GB AIC running under Windows Server 2008 R2 SP1 OS, and Intel® Cache Acceleration Software V2.5. The live demo proves the Cache Appliance Solution's stability, manageability, security, and cost-effectiveness as a perfect choice for Data Center, Storage, and HPC applications.

The Coprocessor Compatible Product Lines Targeting HPC and Datacenter

TYAN showcases various Coprocessor compatible platforms aimed at the HPC and datacenter fields. TYAN S7050, S7055, and S7065 are Intel® Xeon® processor E5-2600 v2 based motherboards which are compatible with up to (4) Intel® Xeon Phi™ Coprocessors. Ranging from 1U, 2U, to 4U, TYAN presents its GA80-B7061, TA77-B7061, and FT77B-7059 server barebone that supports (2) Intel® Xeon® processor E5-2600 v2 and up to (8) Intel® Xeon Phi™ coprocessors. These coprocessor compatible platforms are designed to deliver higher parallel computing performance, faster data transmission, and greater data storage capability, and are the perfect solutions for the HPC and Datacenters.

The Cloud Computing Product Lines Deliver Faster Data Transmission Capability in Low Operation Cost

TYAN S7063, S7066, and S5530 server motherboard, as well as GT24-B7067 server barebone, are designed for cloud computing which help customers to build an efficient and affordable computing infrastructure whether in a new-built IT server room or a hybrid cloud computing environment. S5530 is single-socket server motherboard in ATX form factor which supports (1) Intel® Xeon® processor E3-1200 v3/Intel® Core™ processor i3, (4) DDR-III DIMM Slots and (2)10 GbE ports. TYAN S7063, S7066, and GT24-B7067 are the new products which support (2) Intel® Xeon® processor E5-2600 v2 and multiple GbE ethernet ports and will deliver faster data transmission capability with lower operation cost. All the above platforms will be showcased at TYAN Private Demo Room during Computex 2014.

The SMB Product Lines Provides Various Choices to Customers in Building its IT Infrastructure.

TYAN presents its S5532-UHE and S5532-LE server motherboard as well as its GT24-B7066, GT56-B7066, TN70-B7066, RN65-B7053, and FT68-B7910 server barebone during Computex 2014. With various products offerings to SMB and mainstream server rooms, TYAN platforms are easy to deploy, manage, and maintain, and meet users' various demands. For customers looking for low cost and high-density solutions, the TYAN S5532-UHE and S5532-LE are single-socket server motherboard in ATX form factor which supports (1) Intel® Xeon® processor E3-1200 v3/Intel® Core™ processor i3. Ranging from 1U to 2U, TYAN provides its GT24-B7066, GT56-B7066, and TN70-B7066, which supports (2) Intel® Xeon® processor E5-2600 v2. For higher data storage and faster data-transmission capability, TYAN showcases its TN65-B7053 storage server supporting (16) HDDs in a 3U chassis, as well as FT68-B7910 that supports (2) Intel® Xeon® processor E5-2600 v2, (2) Intel® Xeon Phi™ coprocessors and (64) 2.5" HDDs in a 4U chassis.

The Embedded Product Lines Provides Different Solutions in Different Applications

For the critical requirements from embedded field, TYAN presents its S5535-HE and S7053-HE motherboard in various form factors at the TYAN Private Demo Room. Supporting (1) Intel® Xeon® processor E3-1200 v3 and Intel® Core™ processor i3 in Micro-ATX form factor, the S5535-HE motherboard is the energy-saving, lower power solution designed for embedded application that could be deployed into a box without any special design change. Supporting (2) Intel® Xeon® processor E5-2600 v2, (8+8) DDR-III DIMM slots, and (2) PCI-e x16 slots in a standard SSI-EEB form factor, TYAN S7053-HE embedded motherboard is an ideal solution which delivers tremendous power and could be easily combined into general x86 server computing environment. These two are perfect solutions for digital signage, gaming, health care, POS, or other embedded applications.

Visitors are welcomed to experience TYAN's full product portfolio at the TYAN Private Demo Room (#449) on 4th floor of TWTC Nangang Exhibition Hall during the Computex 2014 in Taipei from June, 3rd to 7th, 2013. The TYAN Cache Appliance Solutions will be available in Q3. Contact your local TYAN sales representative for on-site meetings or product availability. For more detailed product information, please visit the TYAN website: www.tyan.com

** Intel, Xeon, Core and Xeon Phi are registered trademarks of Intel Corporation in the United States and other countries.


**Related Products: http://www.tyan.com/catalog/2014-TYAN-Intel-Catalog.pdf
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