Inspired by the Open Compute Project's mission of "Hacking Conventional Computing Infrastructure," AMD collaborated with some of the world's largest and most demanding financial services IT groups to devise AMD Open 3.0, the first and only Open Compute platform that can be deployed in a standard rack infrastructure. With AMD Open 3.0, AMD and its partners have created a motherboard design that delivers on the breakthrough objectives of the Open Compute Project. For IT managers who run large data centers, AMD Open 3.0 offers the ability to lower infrastructure costs dramatically without compromising on standards, reaching previously unheard of levels of flexibility, efficiency, energy consumption, and operating costs.
AMD Open 3.0: A Single, Adaptable Platform
AMD Open 3.0 is a single platform that can be adapted easily for cloud computing, storage and high-performance computing (HPC). Defined and reviewed by major financial services firms, the AMD Open Compute Project 3.0 ("OCP 3.0") specification is a radical rethinking of motherboard design. AMD Open 3.0 realizes the Open Compute Project's goal of overturning the rules that have governed data center economics for a generation. It opens new thresholds of flexibility and efficiency while driving costs ever lower.
AMD Open 3.0 comes in a flexible form factor, efficient processing, enabling organizations to achieve a lower total cost of ownership (TCO). Low TCO is achieved through a combination of reduced power consumption, lower acquisition cost and streamlined maintenance and operating requirements.
It is designed to be a universal motherboard, in terms of functionality, that supports the majority of enterprise infrastructure use cases, including:
|General Computing / Cloud|
Making it Happen
The AMD Open 3.0 specification is defined as a "feature-correct" motherboard designed to be efficient, inexpensive and easy to service. Every design choice contained in the final product is the result of rigorous analysis of the true infrastructure needs of a major enterprise.
Advancing from Open Compute Project 2.0 ("OCP 2.0")
AMD engaged early with the Open Compute Project. AMD Open 3.0 is a realization of the OCP 3.0 standard. It takes the Open Compute capability well beyond OCP 2.0. The following table summarizes the improvements and differences between OCP 2.0 and Open 3.0.
|AMD Open 3.0||AMD Open 3.0 Advantage|
|Designed for Financial Service Companies with designed in compatibility for Facebook's infrastructure||
|Supports AMD Opteron™ 6300 series, with TDP as low as 85W||Reduced power use|
|16" x 16.5" motherboard||First and currently the only Open Compute motherboard to meet OpenRack standard|
||More memory per core|
|Client choice of NIC||Greater choice and cost flexibility for using NIC of choice|
||Flexibility to support different usage scenarios, e.g. PCI express allowing for different controllers to be plugged in depending on whether it is for cloud or storage workload|
|Open hardware management||Ability to manage servers Out of Band (OOB) - powering up servers remotely, rebooting, re-imaging the OS from remote sources, monitoring temperate, fan speeds, etc|
|Adheres to standard 19" rack size. (But, available in 1, 1.5, 2, 3 and 4U versions)||Variety of form factors but also able to fit into a standard rack enclosure|
|Standard validation (Adheres to Openrack and other OpenCompute standard form factors.)||Lower cost to acquire and deploy|
AMD Open 3.0 Highlights
- 16" x 16.5" motherboard. Universal motherboard, in terms of size, able to fit in both a legacy 19" data center rack and an OCP data center rack
- Component population options depending on target usage
- Open Machine Management with cost effective options depending on requirements
- Supports traditional rack and Open Rack infrastructures
- Support for the full portfolio of AMD Opteron 6000 Series processors with AMD's highest memory capacity and bandwidth operation
- Open Standard Baseboard Management Controller (BMC) in sync with Open Compute Open Hardware Management initiative
- Fit across a wide variety of non-proprietary 1U, 1.5U, 2U, 3U and 4U mechanical stamped sheet metal enclosures supporting both 2.5" and 3.5" disc drives
- Minimum semiconductor and on-board silicon to reduce both purchasing and operating cost
An Adaptable Base Module
The AMD Open 3.0 base module can be adapted to serve each specialized workload with additional elements, such as hard drives, added as needed. It has a common chip set and common BIOS. The components are also interchangeable.
Flexible Form Factors
AMD Open 3.0 is available in a new range of form factors that enable new levels of flexibility in rack configuration. It fits across a range of non-proprietary 1U, 1.5U, 2U, 3U and 4U mechanical stamped sheet metal enclosures that support 2.5" and 3.5" disc drives. In cases where power and space are limited such new choices in sizing can be essential to the economics of IT operations. For example, many financial services firms must place data centers in premium urban real estate, where space and power are extremely limited.
To keep acquisition and operating costs low, AMD Open 3.0 is designed with a minimum of options on the base module. There are fewer legacy components to manage, service, and replace. AMD Open 3.0 helps minimize on-board silicon to reduce both purchasing and operating costs.
Reducing Power Consumption
AMD Open 3.0 motherboard is optimized to deliver the highest level of computational power within the lowest power envelope.
- Fewer ASICs translate into reduced power use (less silicon, less energy required.)
- The AMD Open 3.0 smaller size motherboard requires less power to run.
- Form factors potentially enable more compute power in smaller physical spaces, resulting in lower cooling and overall energy consumption.
- New, more efficient voltage regulators and power supplies also help keep power use low.