Newsroom > > TYAN PARTICIPATES AND SHOWCASES ITS CUTTING EDGE PLATFORMS AT INTEL SOLUTION SUMMIT 2014

TYAN Press Release

TYAN PARTICIPATES AND SHOWCASES ITS CUTTING EDGE PLATFORMS AT INTEL SOLUTION SUMMIT 2014

Products: S5530 S5535 S5535-HE S7065 S7066 
R.KGT62A 


Copenhagen, Demark – April 7th, 2014 –TYAN, an industry-leading server platform design manufacturer and subsidiary of MiTAC Group, is pleased to announce that it is going to participate in Intel Solution Summit 2014 (ISS 2014) and demonstrate its cutting-edge platforms at ISS EMEA as well as ISS APAC. Attendees will experience Tyan's extraordinary and innovative platforms and meet TYAN's team with opportunities to discuss how to build ideal IT infrastructure.

TYAN will showcase its S5535 motherboard and GT62A chassis during ISS EMEA, at Bella Center, Copenhagen, Demark, from April 9th to 10th. Supporting one Intel® Xeon E3-1200 v3 or Intel® Core™ i3 series processor and multiple expansion slots as well as four DDR-III DIMMs, the single-socket TYAN S5535 motherboard is designed for embedded, gaming, telecommunication, digital signage, medical and healthcare applications. The TYAN GT62A is a 1U chassis which supports motherboards in SSI EEB/EATX/SSI CEB and ATX form factor and supports up to ten hot-swap 2.5” HHD or SSDs. It is a mainstream 1U rackmount chassis for near-line storage and other applications from could computing field.

TYAN will also showcase its S5530, S5535, S7065, S7066 server/workstation motherboards and its GT62A chassis during ISS APAC in Singapore, from April 29th to May 1st. TYAN's S5535 is designed for embedded application while the S5530 is target Cloud Computing. The S5530 features support for one Intel Xeon E3-1200 v3 or Intel® Core™ i3 processor as well as four DDR-III DIMM slots and multiple storage connectors on board which makes it an ideal platform for the cloud market. TYAN's S7065 is a dual socket motherboard supports two Intel Xeon E5-2600 v2 series processors, sixteen DDR-III DIMM slots, two PCI-E Gen3 X16 slots and multiple expansion slots which targets the application of co-processor, GPU, workstation and HPC. TYAN's S7066 is designed for virtualization and SMB market and supports two Intel Xeon E5-2600 v2 series processors, sixteen DDR-III DIMM slots, two PCI-E Gen3 X16 slots and Three GbE ports.

Please Contact your local TYAN sales representative for on-site meetings or showcase visiting during the ISS EMEA and ISS APAC. For more detailed product information, please visit the TYAN website: www.tyan.com

** Intel and Xeon are registered trademarks of Intel Corporation in the United States and other countries.
** Related ISS 2014 Information: http://www.tyan.com/card/2014_ISS/index.htm
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